Wangling F4BTMS615 2-Layer 0.254mm Immersion Tin PCB for Aerospace Applications
1.Introduction to Core Technologies
The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. The material has been enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, resulting in substantial improvements in material performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and can replace similar foreign products.
By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.
The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.
2.Key Performance Characteristics:
Dielectric constant (Dk) of 6.15 at 10GHz
Dissipation factor of 0.0020 at 10GHz, 0.0023 at 20GHz
CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 40 ppm/°C, -55°C to 288°C
Low thermal coefficient of Dk at -96 ppm/°C, -55°C to 150°C
High Thermal conductivity of 0.67 W/mk
Moisture absorption of 0.1%
3.PCB Details
| Parameter | Specification |
|---|---|
| Base Material | F4BTMS615 |
| Manufacturer | Wangling |
| Layer Count | 2 layers |
| Board Dimensions | 45.8mm × 102.1mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Tin |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
F4BTMS615 Core - 0.254 mm (10mil)
Copper Layer 2 - 35 μm
5.PCB Statistics
Components: 18
Total Pads: 42
Thru Hole Pads: 15
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 35
Nets: 2
6.Typical Applications
Aerospace equipment, space and cabin equipment
Microwave, RF
Radar, military radar
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications, and more
7. Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
